Mold Compound Management System
Automated Storage and Handling for Mold Compounds
UB Mold Compound MMS is engineered for the temperature-regulated storage of encapsulation materials. We maintain the specific thermal conditions required to preserve the chemical reactivity and flow characteristics of epoxy mold compounds.
We automate the tracking of batch numbers and expiration dates to ensure material consistency. By preventing thermal fluctuations, our system ensures that mold compounds perform reliably during the transfer molding process, reducing voiding and manufacturing defects.
Chemical Stability Control
Thermal Regulation
Precision cooling or climate control prevents premature curing or aging of epoxy compounds, extending the usable life of the material.
Batch & Expiry Alerts
Automated notifications inform operators of upcoming expiration dates, ensuring that only validated, high-quality compounds are used in production.
Secure Inventory Audit
Real-time data logging tracks every material movement, providing a clear history of storage conditions for regulatory and quality compliance.
Contamination Barrier
The fully enclosed cabinet protects compounds from moisture and dust, ensuring the purity of the encapsulation material for high-reliability packages.
Targeted Material Solutions
Technical Specifications
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Dimension
5000 mm (L) x 1400 mm (W) x 2280 mm (H)
Capacity
48 bins / Storage ( 48 bin x 15 KG = Max 720 Kg)
Mold Compound Bag
1.0 kg / 2.0 kg / 5.0kg
Scrap Bin
Stand Alone Type with 30 Kg Capacity
Network Capability
Yes
User Interface
Touch Screen Monitor, Keyboard w/ Touchpad, RFID Badge Scanner
Weighing Scale
20Kg ( Max ) Range 50 gram
Power Supply
230 VAC
N2/CDA supply Inlet with On/Off Control Valve
Humidity Control 15% - 20%, Temperature 20+/-5 degree Celsius
Air Supply Pressure ( CDA )
0.5 to 06 Mpa ( 5 to 6 bar )
Type of Scanner
Handheld Barcode Scanner