Substrate Management System
Precision Material Control
Ultra-Low Humidity
High-performance desiccant systems maintain an internal environment below 5% RH, preventing the "popcorn effect" during subsequent reflow soldering.
Floor-Life Monitoring
Integrated software tracks the cumulative time substrates are exposed to ambient air, ensuring they are processed within safety windows.
ESD Protection
The storage unit is constructed with anti-static materials and grounding features to protect sensitive circuitry from electrostatic discharge damage.
High-Density Organization
Specialized shelving configurations allow for the high-volume storage of diverse substrate types while maintaining easy accessibility and tracking.
Technical Specifications
Dimension
1700mm (L) X 1550mm (W) X 2100mm (H)+300
Storage Capacity
Full Bundle : 94 bundles (2 bundles / bin)
Partial Bundle : 282 bundles (6 bundles / bin)
No. of Bin
47 pcs
Load Port
1 unit (Qty: 5 full bundles)
Unload Port
1 unit (Qty: 5 full bundles)
Cycle Time
Load: =<15 seconds (exclude labelling & weighing)
Weighing: ≈<16 seconds
Labelling: ≈<12 seconds
Sorting: ≈ 20 seconds (2 full bundle bin)
FFU
Yes
Control System
IPC + PLC
Handler Type
Telescopic
Power Source
50/60 Hz Single Phase 230 VAC 13A
Scanner
2 Inline Scanner ( 1 at Arm1 & 1 at Arm 2)
1 Handheld Scanner
Monitor
23”
Weighing Scale
0.1g to 3000g
Label Printer
1 unit – Zebra RIFD printer
RFID/ Badge Reader
1 unit
CCTV
4 units
RFID Read/Write Module
1 unit mounted at Arm 1
Targeted Material Solutions
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Yield Protection & Handling
UB Substrate MMS provides a specialized moisture-sensitive storage environment for advanced semiconductor substrates. We utilize active desiccant technology to prevent moisture absorption, ensuring substrates remain dry and ready for the high-heat assembly process.
We provide a fully tracked storage solution that monitors the "floor life" of sensitive materials. By ensuring substrates are stored in a low-humidity atmosphere, we eliminate delamination risks and improve overall package reliability during downstream manufacturing.