Automated Material Transport for Semiconductor Ovens

Summary

The deployment of tray-handling AGVs and an integrated AGVC dispatch system automates the loading and unloading of high-temperature semiconductor ovens. This solution maximizes throughput while navigating strict space constraints and complex automated door integrations.

Application: K3 4F Oven Automated Material Transport

Scale: 22 oven units and 44 chambers across 3 production lines.

Environment: Constrained 179 cm working width with 950 mm narrow aisles

Payload: AGV rated for 150 kg or greater per trip.

Business Challenges

• Severely restricted 179 cm working widths and 950 mm aisles.

• High-temperature workflows requiring strict thermal verification (≤100°C) before handling.

• Complex automated door handshakes required to prevent face-to-face oven collisions.

• High-throughput transport demands for heavy materials up to 50 kg

Solutions

• Deployed tray-handling AGVs featuring Laser SLAM navigation and agile omni-directional wheels.

• Engineered a telescoping push-pull mechanism with vision positioning for precise tray handling.

• Integrated AGVC and Dispatch Systems with the host for dynamic path planning and traffic control.

• Ensured zero-contact safety using Dual Laser LiDAR, stereo-vision, and a 360° safety edge.

• Enabled continuous operation via auto-charging piles and high-capacity LiFePO4 batteries.

Results

• Fully automated oven door operations, completely removing manual intervention during the high-temperature baking cycle.

• Delivered continuous material flow to meet high-volume targets of 50 UPH for loading and 140 UPH for unloading across 22 ovens.

• Eliminated face-to-face oven collisions via intelligent multi-robot cooperative planning and system-level handshakes.