Industry
Semiconductor
Client Profile
A major semiconductor assembly and test (A/T) manufacturing hub. With thousands of skilled professionals, the facilities assemble and test billions of chips annually, producing high-value semiconductors, automotive pressure sensors, and RFID devices.
Success Story
Precision Control for High-Value Bonding Wires
Summary
UB deployed a Copper Wire Management System to automate the storage, dispensing, tracking, and expiry control of high-value bonding wires. The system records each wire spool issuance time and tracks the 48-hour usage window once opened, ensuring secure, traceable, and compliant material handling.
Operational Challenges
High-value material vulnerability to loss and unauthorized handling.
Unreliable tracking of spool consumption and wire length due to human error.
Disconnect between central storage and wire-bonder workstations, causing production interruptions. Solutions
Automated Copper Wire Management System with 48-hour expiry tracking once wire spools are issued/opened
Secure storage and handling of copper, aluminum, and gold bonding wires
Automated weighing, barcode scanning, and FIFO dispensing to ensure material accuracy
End-to-end traceability with lot-level tracking and usage monitoring
Controlled material issuance with user verification and audit trail to prevent expired wire usage
Results
Improved material control with reduced wire shrinkage by 99%
Enhanced production efficiency by eliminating manual recording with Improved productivity by 20%
Ensured only valid wire was issued for production for better material utilization and reduced wastage
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